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44 řádky
2.7 KiB

  1. (module DM3D-SF (layer F.Cu) (tedit 56AB40D0)
  2. (descr "HRS DM3D-SF MicroSD Push-Pull Connector (SMD)")
  3. (tags "MICROSD CONNECTOR")
  4. (fp_text reference VAL* (at 0 2.875) (layer F.SilkS) hide
  5. (effects (font (size 1 1) (thickness 0.2)))
  6. )
  7. (fp_text value DM3D-SF (at 0 -13.075) (layer F.SilkS) hide
  8. (effects (font (size 1 1) (thickness 0.2)))
  9. )
  10. (fp_text user K.O.A. (at 0.1 -5.875) (layer Dwgs.User)
  11. (effects (font (size 1 1) (thickness 0.2)))
  12. )
  13. (fp_text user K.O.A. (at -0.05 -10.075) (layer Dwgs.User)
  14. (effects (font (size 0.4 0.4) (thickness 0.1)))
  15. )
  16. (fp_line (start 6.65 -9.275) (end 6.65 -9.825) (layer F.SilkS) (width 0.15))
  17. (fp_line (start 1.2 -11.075) (end 1.2 -9.075) (layer Dwgs.User) (width 0.15))
  18. (fp_line (start -1.3 -9.075) (end 1.2 -9.075) (layer Dwgs.User) (width 0.15))
  19. (fp_line (start -1.3 -11.075) (end -1.3 -9.075) (layer Dwgs.User) (width 0.15))
  20. (fp_line (start 4.35 -6.875) (end 4.35 -4.875) (layer Dwgs.User) (width 0.15))
  21. (fp_line (start -4.15 -4.875) (end 4.35 -4.875) (layer Dwgs.User) (width 0.15))
  22. (fp_line (start -4.15 -6.875) (end 4.35 -6.875) (layer Dwgs.User) (width 0.15))
  23. (fp_line (start 5.35 0.525) (end 4.375 0.525) (layer F.SilkS) (width 0.15))
  24. (fp_line (start -4.15 -6.875) (end -4.15 -4.875) (layer Dwgs.User) (width 0.15))
  25. (fp_line (start 6.65 -7.475) (end 6.65 -1.075) (layer F.SilkS) (width 0.15))
  26. (fp_line (start -5.3 -6.775) (end -5.3 -1.075) (layer F.SilkS) (width 0.15))
  27. (fp_line (start -5.3 -9.925) (end -5.3 -11.075) (layer F.SilkS) (width 0.15))
  28. (fp_line (start -5.3 -11.075) (end 5.55 -11.075) (layer F.SilkS) (width 0.15))
  29. (pad DETB smd rect (at -4.925 -9.225) (size 1.55 1) (layers F.Cu F.Paste F.Mask))
  30. (pad GND3 smd rect (at -5.3 -7.725) (size 0.8 1.5) (layers F.Cu F.Paste F.Mask))
  31. (pad DETA smd rect (at 6.25 -10.8) (size 1 1.55) (layers F.Cu F.Paste F.Mask))
  32. (pad GND2 smd rect (at 6.65 -8.375) (size 0.8 1.4) (layers F.Cu F.Paste F.Mask))
  33. (pad GND1 smd rect (at 6.3 -0.125) (size 1.5 1.5) (layers F.Cu F.Paste F.Mask))
  34. (pad GND4 smd rect (at -5.05 -0.125) (size 1.3 1.5) (layers F.Cu F.Paste F.Mask))
  35. (pad 5 smd rect (at -0.55 0) (size 0.65 1.75) (layers F.Cu F.Paste F.Mask))
  36. (pad 4 smd rect (at 0.55 0) (size 0.65 1.75) (layers F.Cu F.Paste F.Mask))
  37. (pad 3 smd rect (at 1.65 0) (size 0.65 1.75) (layers F.Cu F.Paste F.Mask))
  38. (pad 2 smd rect (at 2.75 0) (size 0.65 1.75) (layers F.Cu F.Paste F.Mask))
  39. (pad 1 smd rect (at 3.85 0) (size 0.65 1.75) (layers F.Cu F.Paste F.Mask))
  40. (pad 6 smd rect (at -1.65 0) (size 0.65 1.75) (layers F.Cu F.Paste F.Mask))
  41. (pad 7 smd rect (at -2.75 0) (size 0.65 1.75) (layers F.Cu F.Paste F.Mask))
  42. (pad 8 smd rect (at -3.85 0) (size 0.65 1.75) (layers F.Cu F.Paste F.Mask))
  43. )